MEP EP#281: Through Hole Manufacturing
Jun 17, 2021•59 min•Ep. 281
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Episode description
MEP EP#281: Through Hole Manufacturing
Through Hole Manufacturing
- Processes
- Hand Soldering
- Soldering “robot”
- Wave soldering
- Design Criteria
- Pallets
- Selective soldering
- Design Criteria
- Keepouts
- Lead Forming
- Pre purchase?
- Forming with a die?
- Using hand tools?
- PCB design
- Holes
- Non circular?
- Annular rings
- IPC stuff
- IPC-2221 Generic Standard on Printed Board Design
- IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards
- IPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
- IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard
- Performance Classification (1,2,3)
- Producibility Levels (A,B,C)
- Land Pattern Determination (Density level A,B,C)
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