Adhesive Lets 3-D Microchips Go Deep
Sep 29, 2011•1 min
Listen to this episode in Metacast mobile app
Don't just listen to podcasts. Learn from them with transcripts, summaries, and chapters for every episode. Skim, search, and bookmark insights. Learn more
Episode description
IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports
For the best experience, listen in Metacast app for iOS or Android